about

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About CTIEEM 2026

The 5th International Conference on Computer, Information Engineering and Electronic Materials ( CTIEEM 2025 ) will be held in Harbin, China from December 12 to 14, 2025. With the theme of " Computer, Information Engineering and Electronic Materials, " this conference aims to build an interdisciplinary and cross-disciplinary international communication platform to promote the deep integration and coordinated development of computer science, information engineering and electronic materials. With the rapid development of artificial intelligence, quantum computing, new energy materials and other fields, single subject research has been difficult to meet the needs of complex technology. CTIEEM 2025 encourages scholars to break through the boundaries of traditional disciplines and explore innovative solutions. We sincerely invite representatives of different universities, research institutes and enterprises to gather in Harbin to share the latest research results and explore future technology trends.

date

Important Dates

Full Paper Submission Date: 2026

Registration Deadline: 2026

Final Paper Submission Date: 2026

Conference Dates: December 11-13, 2026

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Call For Papers

The topics of interest for submission include, but are not limited to:

📚️️Computer Technology

· Quantum Computing for Advanced Problem Solving

· Machine Learning in Automated Manufacturing Systems

· Edge and Cloud Computing Integration

· Virtual Reality Systems for Simulation and Training

· Autonomous Systems: Robotics and Drones

· Blockchain Applications in Secure Computing

· Artificial Intelligence for Predictive Analytics

· Advanced Algorithms for Big Data

· Cybersecurity Protocols for Next-Generation Networks

· Computational Models for Complex Systems Analysis

📚️️Information Engineering

· Wireless Communication Systems and Network Topologies

· Embedded Systems and Network Security

· Data Mining Techniques in Multimedia Information

· Information Theory and Signal Processing

· Multi-source information fusion technology

· Digital Forensics and  Data Analysis

· Cloud-based Data Centers and Infrastructure

· Semantic Web and Data Interoperability

· Advanced System Architectures for Big Data

📚️️Electronic Materials

· Nanoelectronics and Their Application in Computing

· Materials for High-Performance Semiconductors

· Wearable Electronics and Smart Fabrics

· Photonic Materials for Optoelectronic Devices

· Advanced Dielectric Materials for Capacitors and Transistors

· Materials Science in Energy Storage Technologies

· Electronic Displays: From OLEDs to Flexible Screens

· Thermal Interface Materials for Heat Management

· Materials for Wireless Sensor Networks

· Eco-friendly Materials for Sustainable Electronics

Publication

Publication

All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.

📚️️  CTIEEM 2024

📗️️Ei Compendex

📙️️Scopus

📚️️  CTIEEM 2023

📗️️Ei Compendex

📙️️Scopus

📚️️  CTIEEM 2022

📗️️Ei Compendex

📙️️Scopus

📚️️  CTIEEM 2021

📗️️Ei Compendex


Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

contact

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Contact Us

Conference Secretary: Ms.Yuin Hun

Tel: +86-18922115477 (WeChat)

E-Mail: CTIEEM@163.com

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If you have any questions or inquiries, please feel free to contact us.

Organizer By

Organizer By

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Supported By

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